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Lead-free as well as standard eutectic processes |
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Populating devices as small as 0201 |
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Populating fine pitch devices to 0.25mm pitch |
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Populating 0.4mm pitch CGA, PBGA and CSP area array devices |
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Populating through-hole parts such as multi-pin connectors and odd-form parts |
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Inspection capabilities to IPC 610 requirements CLASS 1, 2 or 3 including the newest lead-free requirements |
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Complex PCB rework and repair of PCBs including base board laminate, pad/trace repair or modification |
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Reballing and repair of BGAs |
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XRAY, microscopic and endoscopic inspection of area array packages |
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"Box build" and other mechanical assembly |
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Functional testing |
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Inclusion and mass copying/packaging of instruction manuals for products |
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