BESTProto

BESTProto September/October 2011 Newsletter

best — Tue, 27 Sep 2011 19:46:06 +0000

Getting Via in Pad Right the First Time!

There are numerous reasons you may want to use via-in-pad designs. These reasons may include all /some of the following:

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BESTProto June/July 2011 Newsletter

best — Wed, 07 Sep 2011 13:47:39 +0000

TI OMAP Placement-Experience Counts!

BESTProto has experience in assembling the TI OMAP processor PoPs for a variety of prototype assembly applications. We use a…

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BESTProto March/April 2011 Newsletter

best — Wed, 07 Sep 2011 13:29:29 +0000

LGA Placement Several clients recently have come to BESTProto where the build has included Land Grid Array (LGA) package types. Land Array packages are part of the…

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BESTProto January/February 2011 Newsletter

best — Wed, 07 Sep 2011 13:23:48 +0000

REACH (Registration, Evaluation & Authorization of Chemicals).

In 2011 you will likely be hearing quite a bit about the REACH regulations. Below is a summary of these new European regulations and how it may impact the electronics business.

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Mark H

admin — Wed, 09 Feb 2011 09:09:49 +0000

Mark H. Manufacturing Manager for a world-renowned computer manufacturer said “The first boards passed all bench tests right out of the box. “Another great job on a very difficult to build board assembly.” And “Overall a very good build on these tough boards. Pass the word to those involved, along with my thanks.”

On another build Mark H. said, “All of the boards checked out very well. This was a great build. I’ll have information on the next board type I want you to build shortly. Nice work.”

Dan B

admin — Wed, 09 Feb 2011 08:31:15 +0000

Dan B. an FAE for a large multinational semiconductor manufacturer said “Woohoo!!, thanks!” When we told him we would ship the “eval” boards he needed to land a new account, two days ahead of schedule.

John O

admin — Wed, 09 Feb 2011 08:29:13 +0000

John O. Hardware Designer from Chicago said “I really appreciate your willingness to dive in with us to tackle issues like these.”

Bob A

admin — Wed, 09 Feb 2011 08:28:51 +0000

Bob A. Engineering Manager from NY sent an email saying “Just took a good look at the work you did on my chips with my jeweler’s eye-piece. Beautiful!”

BESTProto Fall 2010 Newsletter

best — Mon, 11 Oct 2010 21:02:42 +0000

Mixing Lead-Free and Tin-Lead Solder on a PCB Assembly

In this issue we talk about mixing lead-free (RoHS) solder with tin-lead solder (Sn63) paste on your PCB assemblies. This situation arises most often when introducing a lead-free BGA (Ball Grid Array) device with a PCB assembly that’s being processed using tin-lead solder.

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BESTProto Spring 2010 Newsletter

best — Thu, 17 Jun 2010 00:37:46 +0000

BESTProto proudly announces that we are now ITAR registered. (International Traffic in Arms Regulations).

For those unfamiliar with ITAR it’s a mandate by the U.S. Department of State with regulations that dictate that any Click here to read more: