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BESTPROTO- Tips on Turning Your Design into Reality
Guidelines on Making Your Prototype Builds "Assembly Ready"
- Sept-Oct 2007
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In this end of summer newsletter we wrap up our pcb prototype assembly "tips" . This is the last in a series designed to insure a smoother, trouble free prototype build.

The guidelines below along with three others in the series that you can find in our archives can help you standardize the fabrication and assembly of your prototype assembly builds, while lowering their cost. When followed, these help reduce errors and make sure that your prototype can be built accurately and as quickly as possible.

Call BESTProto to insure the success of your next prototype build (847) 797-9250.

The following guidelines, the last in a series, apply to making your prototype board build "assembly ready" .
The info below continues the outline we started previously concerning the "best practices" of board design for assembly.

Silk screen Use a silk screen outline on the board to indicate the preferred location of things like serial number labels and other required stamps or labels. It is good practice to make sure the silk screen of polarized devices are designed so that it is not covered after of components are placed. A screen line width of 0.010" is preferred for component outlines. Text sizes should be greater than 0.050" in order to be readable to the inspector of the assembly. Minimum spacing of 0.010" is recommended between the silk screen and pads

Pads A good rule of thumb for the pad diameter of a through-hole component is twice its finished hole diameter.

Vias Do not place exposed vias underneath 0805 or smaller chip components. A good rule of thumb for via pad diameter design is that it should be 0.020" larger than the diameter of the finished hole for that via. It is also good practice to make sure that the cross-sectional area of a via is equal to or greater than the cross-sectional area of the trace connected to it.
A minimum soldermask web of 0.003" is preferred between SMT pads and vias.

Board Outline/Edges It is recommended that a minimum 0.010" line width should be used to draw the board outline. When you are creating Gerber files for manufacturing, the board outline should be included on every layer in order to insure that it provides for common features for alignment. Remember to keep copper traces a minimum of 0.010" away from routed edges and 0.020" away from V-scored edges. In addition discrete SMT components should be a minimum of 0.030" away from board edges that are V-scored or have breakaway tabs. It is our recommendation that components should be kept at least 0.030" away from the board edges to prevent their cracking during depanelization. "V-scoring" is preferable to breakaway-tabs.

Garth Cates
BESTPROTO Inc

phone: 847-797-9250
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