Mark H. Manufacturing Manager for a world-renowned computer manufacturer said “The first boards passed all bench tests right out of the box. “Another great job... read more
BESTProto September/October 2011 Newsletter
Posted on: September 27th, 2011
Getting Via in Pad Right the First Time!
There are numerous reasons you may want to use via-in-pad designs. These reasons may include all /some of the following:
BESTProto June/July 2011 Newsletter
Posted on: September 7th, 2011
TI OMAP Placement-Experience Counts!
BESTProto has experience in assembling the TI OMAP processor PoPs for a variety of prototype assembly applications. We use a…
BESTProto March/April 2011 Newsletter
Posted on: September 7th, 2011
LGA Placement Several clients recently have come to BESTProto where the build has included Land Grid Array (LGA) package types. Land Array packages are part of the…
BESTProto January/February 2011 Newsletter
Posted on: September 7th, 2011
REACH (Registration, Evaluation & Authorization of Chemicals).
In 2011 you will likely be hearing quite a bit about the REACH regulations. Below is a summary of these new European regulations and how it may impact the electronics business.
BESTProto Fall 2010 Newsletter
Posted on: October 11th, 2010
Mixing Lead-Free and Tin-Lead Solder on a PCB Assembly
In this issue we talk about mixing lead-free (RoHS) solder with tin-lead solder (Sn63) paste on your PCB assemblies. This situation arises most often when introducing a lead-free BGA (Ball Grid Array) device with a PCB assembly that’s being processed using tin-lead solder.
BESTProto Spring 2010 Newsletter
Posted on: June 16th, 2010
BESTProto proudly announces that we are now ITAR registered. (International Traffic in Arms Regulations).
For those unfamiliar with ITAR it’s a mandate by the U.S. Department of State with regulations that dictate that any Click here to read more:
