SERVICESOther Featured Services
- Lead-free as well as standard eutectic processes
- Populating devices as small as 0201
- Populating fine pitch devices to 0.25mm pitch
- Populating 0.4mm pitch CGA, PBGA and CSP area array devices
- Populating through-hole parts such as multi-pin connectors and odd-form parts
- Inspection capabilities to IPC 610 requirements CLASS 1, 2 or 3 including the newest lead- free requirements
- Complex PCB rework and repair of PCBs including base board laminate, pad/trace repair or modification
- Reballing and repair of BGAs
- XRAY, microscopic and endos copic inspection of area array packages
- “Box build” and other mechanical assembly
- Functional testing
- Inclusion and mass copying/packaging of instruction manuals for products
