Backplanes and Motherboards
Backplanes and Motherboards: BESTProto has experience in and has equipment designed for prototype and low volume assembly of backplanes or a press-fit assembly. Whether you call them midplanes, motherboards, activeplanes, backpanels, or backplanes, these special assemblies have their share of assembly challenges. BESTProto can be your solutions provider for these challenging assemblies.
- PCB Sizes up to . 29” X 24” (745mm X 610mm) in size
- High layer counts with board thickness’ up to 0.39” (10mm)
- We design special fixturing and tooling for press fit connectors
- Heavy thermal heat sinking inner layers
- Press-fit connectors
Our large form factor board assembly process is designed to handle these special requirements. From our large form factor SMT -surface mount pick and place machines to our knowledgeable press fit tooling expertise BESTProto is your partner for backplane assembly!
The high layer counts typically found in backplanes equates to greater overall thickness of the PCB a challenge that BESTproto has met several times. BESTProto process engineers are experienced at properly profiling and making sure all of the through hole connections are properly wetted and meet the inspection criteria sought.
Some backplane designs exceed the typical overall form factors that most SMT equipment is designed for. Our machinery has the capability to handle boards up to 29” X 24” (745mm X 610mm) in size and weigh as much as 22 pounds (10kG). Also, the machinery has the ability to handle boards-up to .39” or approximately 10mm in thickness.
The heart of many backplane designs are the thousands of compliant pins that make up it’s communication superbackplane. Press fit connectors offer reliable gas tight joints that require special tooling, fixturing and experience to insert properly. BESTProto can engineer, and provide cost effective press-fit connector installations.
