Inspection is a crucial part of the PCB production and assembly process. The inspection process is to ensure high quality and reliable printed circuit boards are assembled. The inspection process helps reveal any design flaws that may exist at different stages during manufacturing and the assembly procedure that must be eliminated.
This blog post will inspect the leading inspection methods. Here is an overview of the various PCB assembly inspection methods.
1. Visual Inspection
Manual visual inspection is the simplest form of PCB inspection. This inspection method can be used after most PCB assembly processes have been conducted. To perform this type of test, a worker looks over the board either with the naked eye or through magnification. Although visual inspection is a method commonly used, its validity depends on the capability of the inspection staff and how they apply the inspection standards.
2. Structural Process Test Inspection Systems
Structural process test inspection is often used for large volumes of production where accuracy and speed are extremely important. This inspection method uses some form of light emissions such as visible lights, lasers, and x-rays to acquire data through real-time image processing for locating and measuring defects related to solder joint quality.
3. Automated Optical Inspection (AOI)
This method typically conducts an inspection using multiple visible light sources with programmable LEDs, one or more still or video cameras and computerized systems for inspecting solder joints.
An automatic optical inspection can find many of the same defects that a VMI can, including open circuits, solder thinning, missing components, displaced components and more.
4. Component Value Verification
BESTProto uses the latest technology to verify that not only the correct package size and types are being placed on a board but, we are also able to electrically test the individual components before placement to verify that the are the correct electrical value as well.
5. X-Ray System Inspection
The X-ray method can be performed in two different ways: the X-ray fluoroscopic system and the X-ray lamination system. The fluoroscopic system produces a density image to accurately inspect solder joint distribution, thickness, and internal integrity. The lamination system, on the other hand, uses X-rays to generate focal planes of a horizontal sectional area of a PCB.
Inspection is a crucial part of the PCB production and assembly process. There are five different types of manufacturers, and assemblers can use to inspect the PC board assemblies and help to eliminate workmanship defects. BESTProto ensures quality through our quality assurance program and continues our commitment from first articles through a disciplined approach to process control. Contact our team today to request a quote on your PCB Assembly project today.