BESTProto offers electronic assembly services for single or multi-layer flexible or rigid circuit boards for passives as small as 0201s, BGA and micro BGA, flip chips and leadless devices.
We can also perform conventional through hole assembly of mixed technology assembly in single or double sided configuration. Electronic components can be placed on standard rigid, hybrid ceramic or flexible circuit substrates.
BESTProto utilizes both automated and manual equipment to assemble low volume PCB assemblies. The production areas are within an ESD and climate controlled environment. Personnel are trained and qualified in IPC-A-610 Workmanship Standards for inspection, IPC JSTD-001 workmanship guidelines for assembly as we work within ESD 2020 guidelines to help in ensuring a quality assembly.
Other Assembly Services
BESTProto can place a variety of SMT components down to 0201 sizes. These components are placed using our automated assembly equipment. It has the added capability of testing the value of passive resistor and capacitor values as well as diode orientation helping ensure that the right values are placed at the right locations the first time. We also specialize in larger form factor PCB and circuit card assemblies with Backplane PCB assembly being a unique capability.
Through hole Assembly
Our through-hole assembly operation assures consistent placement of components. Odd-form and other parts can be placed using our trained hand-stuff operators. Gluing, conformal coating, and selective wave soldering are all accomplished by highly skilled operators. We use a no-clean soldering process with either tin/lead or lead free alloys to produce robust solder joints. The components are soldered either by hand or using our selective soldering machine.
Leadless Device Placement (LGA and QFN)
BESTProto has extensive experience in placing leadless devices including LGAs and QFNs. The correct stencil design and placement accuracy is critical to insuring that these parts are placed correctly. These packages, which can have solder bumps or lands located on the package, can be placed, x-rayed and reworked by BESTProto personnel.
Ball Grid Array (BGA)
BESTProto has extensive experience in placing, inspecting, troubleshooting and reworking BGAs. BGA and MicroBGA components are placed using our automated pick-and-place equipment with its vision system. The accuracy and repeatability of this equipment ensures perfect solder joints, down to 0.4mm pitch components. We can place and have experience in assembling ceramic and metal carrier parts onto circuit boards as well as column grid array components. This expertise is backed up with the latest in X-ray technology, endoscopic visual inspection, and multiple high end rework systems.
Contact BESTProto for customized solutions to your electronics assembly priorities.